Accessory Compatibility
| Recommended | Not Recommended | |
| Build Plate | Engineering Plate, High Temperature Plate or Textured PEI Plate | Cool Plate |
| Hotend | All Size / Material | / |
| Glue | Glue Stick | Bambu Liquid Glue |
RFID for Intelligent Printing
All printing parameters are embedded in RFID, which can be read through our AMS (Automatic Material System).
Load and print! No more tedious setting steps.
| Recommended Printing Settings | |
| Drying Settings (Blast Drying Oven) | 80 °C，8h |
| Printing and Keeping Container's Humidity | < 20% RH (Sealed, with Desiccant) |
| Nozzle Temperature | 250 - 270 °C |
| Bed Temperature (with Glue) | 90 - 110 °C |
| Printing Speed | < 300 mm/s |
| Physical Properties | |
| Density | 1.20 g/cm³ |
| Vicat Softening Temperature | 119 °C |
| Heat Deflection Temperature | 117 °C |
| Melting Temperature | 228 °C |
| Melt Index | 32.2 ± 2.9 g/10 min |
| Mechanical Properties | |
| Tensile Strength | 55 ± 4 MPa |
| Breaking Elongation Rate | 3.8 ± 0.3 % |
| Bending Modulus | 2310 ± 70 MPa |
| Bending Strength | 108 ± 4 MPa |
| Impact Strength | 34.8 ± 2.1 kJ/m² |
Printing Tips:
• Due to the transparent properties of the filament, Lidar Extrusion Calibration can be affected when printing Transparent PC.
• Bambu PC needs proper drying before printing, recommended drying temperature is 80 ℃ for 8 hours in a blast drying oven, or 100 ℃ for 12 hours on a printer's heatbed. For more details please refer to: Filament drying cover on WIKI.
What's in the Box
Filament*1 & Desiccant*1
Package*1